You are here: Home > Products > Underfill Adhesive
Underfill Adhesive
Technical characteristics:
One component, halogen free;
Rapid flow at room temperature;
Fast curing ,high reliability;
Good compatibility with solder paste;
Reworkable.

Application fields:
Mobile phone;
Automobile module;
Fingerprint recognition module;
Entertainment device, etc.
        
PRODUCT Info


Product Model Colou viscosity(cps) Cure Condition Period of use by room temperature shelf life
EA5366 Black 350-450 6-8 min@130℃ 3 days 6 Months@-25℃
EA5616 Black 350-500 6-8 min@130℃ 3days 6 Months@-25℃
EA5325 Black 740-800 5-8 min@120℃ 3days 6 Months@-20℃

 
Baidu
sogou