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Technical characteristics:
Low shrinkage, High adhesion;
Storage stability, Do not sensitive to moisture;
Fast curing （Radiant intensity less than 1000mJ/cm²）;
Shadow area can be “dark curing”reaction; High dielectric strength, High corrosion resistance.
Low shrinkage, High adhesion;
Storage stability, Do not sensitive to moisture;
Fast curing （Radiant intensity less than 1000mJ/cm²）;
Shadow area can be “dark curing”reaction; High dielectric strength, High corrosion resistance.