Performance

No release of by-products duringcuring, safety and environmental protection
Good adhesion to the substrate, nocorrosion, no pollution
No cracking, good elasticity and highbonding strength
Hydrophobic, with excellent waterproof performance
Excellent aging resistance and weather resistance
Wide range of applications, suitable for a variety of substrates


Application

Bonding of electronic components、Enclosure of components、Wire Harness、Bonding and sealing of electronic appliances、Circuit board thick waterproof、High solder joint protection